216L Industrial Step Oven for Lab Drying and Electronic Component Curing
This 216L industrial step oven supports aging, drying, curing and defoaming for PCBA, new energy and composite materials. It features RT~+200℃ temperature range with programmable step profile: 65℃→85℃→110℃→60℃, non‑linear no‑load heating rate of approx. 3.5℃/min, and 0.01℃ precision programmable controller. Equipped with exhaust cooling device and viewing glass window. Horizontal air convection delivers even heat distribution for reliable thermal simulation and product reliability testing.
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