What is Environmental Testing?
The electronic devices and industrial products we rely on every day are affected by the environment in many ways, including temperature, humidity, pressure, light, electromagnetic waves and vibration. Environmental testing analyzes and evaluates the impact of these environmental factors on the product to determine its durability and reliability.
Guangdong Lab Companion LTD., has 10 million yuan registered capital and 3 R & D manufacturing plants in Dongguan, Kunshan and Chongqing. Lab Companion has been specialized in high and low temperature test equipment technology for 19 years, operating according to ISO9001, ISO14001, ISO 45001, ISO27001 four systems, setting sales and maintenance service centers in Shanghai, Wuhan, Chengdu, Chongqing, Xi 'an and Hong Kong. We work closely with International Organization of Leg al Metrology, Chinese Academy of Sciences, State Grid, China Southern Power Grid, Tsinghua University, Peking University, Hong Kong University of Science and Technology and other research institutions.
Main products of Lab Companion includes high and low temperature test chamber, constant temperature and humidity test chamber, rapid temperature cycling test chamber, thermal shock test chamber, high and low temperature and low pressure test chamber, vibration of the comprehensive chamber, industrial oven, vacuum oven, nitrogen oven, etc, providing high quality experimental equipment for universities, research institutes, medical health, inspection and quarantine, environmental monitoring, food and drugs, automobile manufacturing, petrochemical, rubber and plastic products, IC semiconductor, IT manufacturing and other fields.
Is the Future of Semiconductors Bright?
Thanks to the rise of the concept of "5G+ Internet of everything" and the rapid development of new energy vehicles, the demand for chips has increased comprehensively. And because of the impact of the epidemic and Sino-US trade friction, the supply of chips has been affected, so the domestic market will flourish under these factors.
The following is a conceptual diagram of the semiconductor industry chain:
It can be intuitively seen that the semiconductor industry is a very large industrial chain, and the terminal of the final use is inseparable from our lives. They are essentially chips made of silicon wafers.
The following is the flow chart of the chip production:
As can be seen in the figure above, the aging test of the chip is an essential part, and the aging test of the chip needs to use a professional industrial oven for aging test and high temperature baking.
The aging test not only led to the development of industrial ovens, but also led to the development of wafer boxes, automatic plying machines, tape braiding machines and other equipment. This process alone has such a large industry, which shows that the future of semiconductors is still relatively optimistic.
High Temperature Aging Cabinet
High temperature aging cabinet is a type of aging equipment used to remove early failure of non-conforming product parts.
Use of temperature aging cabinet, aging oven:
This test equipment is a test equipment for aviation, automobile, home appliances, scientific research and other fields, which is used to test and determine the parameters and performance of electrical, electronic and other products and materials after temperature environment changes in high temperature, low temperature, alternating between temperature and humidity or constant temperature and humidity.
The chamber of the test equipment is sprayed with steel plate after treatment, and the spray color is optional, generally beige. SUS304 mirror stainless steel is used in the inner room, with a large window tempered glass, real-time observation of internal aging products.
Features of temperature aging cabinet, aging oven:
1. PLC processing industry touch screen programming combination control, balanced temperature control system: aging specimen room temperature rise start the ventilation fan, balance the sample heat, aging cabinet is divided into product area and load area
2. PID+SSR temperature control system: according to the temperature change in the specimen box, the heat of the heating tube is automatically adjusted to achieve the temperature balance, so that the heating heat of the system is equal to its heat loss and achieve the temperature balance control, so it can run stably for a long time; The fluctuation of temperature control is less than ±0.5℃
3. The air transport system is composed of three-phase asynchronous electronic multi-wing wind wheel and wind drum. The wind pressure is large, the wind speed is uniform, and the uniformity of each temperature point is met
4. High precision PT100 platinum resistance for temperature acquisition, high accuracy for temperature acquisition
5. Load control, the load control system provides ON/OFF control and timing control two functional options to meet the different test requirements of the product
(1)ON/OFF function introduction: The switch time, stop time, and cycle times can be set, the test product can be switched according to the setting requirements of the system, the stop cycle control, the aging cycle number reaches the set value, the system will automatically sound and light prompt
(2) Timing control function: the system can set the running time of the test product. When the load starts, the product power supply starts timing. When the actual timing time reaches the time set by the system, the power supply to the product is stopped
6. System operation safety and stability: The use of PLC industrial touch screen control system, stable operation, strong anti-interference, convenient program change, simple line. Perfect alarm protection device (see protection mode), real-time monitoring of the operating status of the system, with the function of automatic maintenance of temperature data during operation, in order to query the temperature historical data when the product is aging, the data can be copied to the computer through the USB interface for analysis (format is EXCEL), with historical data curve display function, It intuitively reflects the temperature change in the product area during the product test, and its curve can be copied to the computer in BMP format through the USB interface, so as to facilitate the operator to make the test product report. The system has the function of fault query, the system will automatically record the alarm situation, when the equipment fails, the software will automatically pop up the alarm screen to remind the cause of the fault and its solution; Stop the power supply to the test product to ensure the safety of the test product and the equipment itself, and record the fault situation and occurrence time for future maintenance.
Thermal Cycling Test(TC) & Thermal Shock Test(TS)
Thermal Cycling Test(TC):
In the life cycle of the product, it may face various environmental conditions, which makes the product appear in the vulnerable part, resulting in product damage or failure, and then affect the reliability of the product.
A series of high and low temperature cycling tests are done on the temperature change at the temperature variation rate of 5~15 degrees per minute, which is not a real simulation of the actual situation. Its purpose is to apply stress to the test piece, accelerate the aging factor of the test piece, so that the test piece may cause damage to the system equipment and components under environmental factors, in order to determine whether the test piece is correctly designed or manufactured.
Common ones are:
Electrical function of the product
The lubricant deteriorates and loses lubrication
Loss of mechanical strength, resulting in cracks and cracks
The deterioration of the material causes chemical action
Scope of application:
Module/system product environment simulation test
Module/System Product Strife test
PCB/PCBA/ Solder Joint Accelerated Stress Test (ALT/AST)...
Thermal Shock Test(TS):
In the life cycle of the product, it may face various environmental conditions, which makes the product appear in the vulnerable part, resulting in product damage or failure, and then affect the reliability of the product.
High and low temperature shock tests under extremely harsh conditions on rapid temperature changes at a temperature variability of 40 degrees per minute are not truly simulated. Its purpose is to apply severe stress to the test piece to accelerate the aging factor of the test piece, so that the test piece may cause potential damage to the system equipment and components under environmental factors, in order to determine whether the test piece is correctly designed or manufactured.
Common ones are:
Electrical function of the product
The product structure is damaged or the strength is reduced
Tin cracking of components
The deterioration of the material causes chemical action
Seal damage
Machine specifications:
Temperature range: -60 ° C to +150 ° C
Recovery time: < 5 minutes
Inside dimension: 370*350*330mm (D×W×H)
Scope of application:
PCB reliability acceleration test
Accelerated life test of vehicle electric module
LED parts accelerated test...
Effects of temperature changes on products:
The coating layer of components falls off, the potting materials and sealing compounds crack, even the sealing shell cracks, and the filling materials leak, which causes the electrical performance of components to decline.
Products composed of different materials, when the temperature changes, the product is not evenly heated, resulting in product deformation, sealing products cracking, glass or glassware and optics broken;
The large temperature difference makes the surface of the product condense or frost at low temperature, evaporates or melts at high temperature, and the result of such repeated action leads to and accelerates the corrosion of the product.
Environmental effects of temperature change:
Broken glass and optical equipment.
The movable part is stuck or loose.
Structure creates separation.
Electrical changes.
Electrical or mechanical failure due to rapid condensation or freezing.
Fracture in a granular or striated manner.
Different shrinkage or expansion characteristics of different materials.
The component is deformed or broken.
Cracks in surface coatings.
Air leak in the containment compartment.
Semiconductor Chip-Car Gauge Chip
A new energy vehicle is divided into several systems, MCU belongs to the body control and vehicle system, is one of the most important systems.
MCU chips are divided into 5 levels: consumer, industrial, vehicle gauge, QJ, GJ. Among them, the car gauge chip is the current vane product. So what does the car gauge chip mean? From the name, it can be seen that the car gauge chip is the chip used in the car. Different from ordinary consumer and industrial chips, the reliability and stability of the car gauge chip is extremely important, so as to ensure the safety of the car at work.
The certification standard of the car gauge level chip is AEC-Q100, which contains four temperature levels, the smaller the number, the higher the level, the higher the requirements for the chip.
It is precisely because the requirements of the car gauge chip are so high, it is necessary to carry out a strict Burn In test before the factory, BI test requires the use of professional BI oven, our BI oven can meet the BI test of today's car gauge chip.
Connect the EMS system, so that each batch of baked chips can be traced at any time. High temperature and low temperature vacuum anaerobic environment, real-time monitoring of baking curve to ensure baking safety and effect.
Vibrational Verification for Functionality(VVF)
In the vibration generated during transportation, freight boxes are susceptible to complex dynamic pressures, and the resonant response generated is violent, which may cause packaging or product failure. Identifying the critical frequency and the type of pressure on the package will minimize this failure. Vibration testing is the assessment of the vibration resistance of components, components and complete machines in the expected transport, installation and use environment.
Common vibration modes can be divided into sinusoidal vibration and random vibration. Sinusoidal vibration is a test method often used in the laboratory, which mainly simulates the vibration generated by rotation, pulsation and oscillation, as well as the resonance frequency analysis and resonance point residence verification of the product structure. It is divided into sweep frequency vibration and fixed frequency vibration, and its severity depends on the frequency range, amplitude value and test duration. Random vibration is used to simulate the overall structural seismic strength assessment of the product and the shipping environment in the packaged state, with the severity depending on the frequency range, GRMS, test duration and axial orientation.
Vibration can not only loosen the lamp components, so that the internal relative displacement, resulting in de-welding, poor contact, poor working performance, but also make the components produce noise, wear, physical failure and even component fatigue.
To this end, Lab Companion launched a professional "LED lamp vibration test" business to simulate the vibration or mechanical shock that may occur in the actual transportation, installation and use environment of the lamp, evaluate the vibration resistance of the LED lamp and the stability of its related performance indicators, and find the weak link that may cause damage or failure. Improve the overall reliability of LED products and improve the failure status of the industry due to transportation or other mechanical shocks.
Service customers: LED lighting factory, lighting agents, lighting dealers, decoration companies
Test method:
1, the LED lamp sample packaging placed on the vibration test bench;
2, the vibration speed of the vibration tester is set to 300 RPM, the amplitude is set to 2.54 cm, start the vibration meter;
3, the lamp according to the above method in the upper and lower, left and right, front and back three directions respectively test for 30 minutes.
Results evaluation: After the vibration test, the lamp can not occur parts falling off, structural damage, lighting and other abnormal phenomena.
Double 85 Constant Temperature And Humidity Reliability Environmental Test (THB)
First, high temperature and humidity test
WHTOL (Wet High Temperature Operating Life) is a common environmental stress acceleration test, usually 85℃ and 85% relative humidity, which is generally carried out in accordance with the standard IEC 60068-2-67-2019. The test conditions are shown in the chart.
Second, the test principle
"Double 85 test" is one of the reliability environmental tests, mainly used for constant temperature and humidity box, that is, the temperature of the box is set to 85℃, the relative humidity is set to 85%RH conditions, to accelerate the aging of the test product. Although the test process is simple, the test is an important method to evaluate many characteristics of the test product, so it has become an indispensable reliability environmental test condition in various industries.
After aging the product under the condition of 85℃/85%RH, compare the performance changes of the product before and after aging, such as the photoelectric performance parameters of the lamp, the mechanical properties of the material, yellow index, etc., the smaller the difference, the better, so as to test the heat and moisture resistance of the product.
The product may have thermal failure when working in a continuous high temperature environment, and some moisture sensitive devices will fail in a high humidity environment. The dual 85 test can test the thermal stress generated by the product under high humidity and its ability to resist long-term moisture penetration. For example, the frequent failure of various products in the humid weather period in the south is mainly due to the poor temperature and humidity resistance of the products.
3. Experimental factors
In the LED lighting industry, many manufacturers have used the double 85 test results as an important means to judge the quality of lamps. Various possible reasons why LED lamps fail the dual 85 test are:
1. Lamp power supply: poor heat resistance of shell, danger of short circuit in circuit, failure of protection mechanism, etc.
2. Lamp structure: unreasonable design of heat dissipation body, installation problems, materials are not resistant to high temperature.
3. Lamp light source: poor moisture resistance, packaging adhesive aging, high temperature resistance.
If you encounter a special use environment, such as the working environment temperature is severe, you need to test its high and low temperature resistance, the test method can refer to the high and low temperature test project.
4. Serve customers
01. Customer group
LED lighting factory, LED power plant, LED packaging factory
02. Means of detection
Constant temperature and humidity test chamber
03. Reference standards
Constant temperature and humidity tests for electrical and electronic products -- Environmental testing -- Part 2: Test methods -- Test Cab: Constant temperature and humidity test GB/T 2423.3-2006.
04. Service content
4.1 Refer to the standard, conduct double 85 test on the product, and provide the third party's test results report.
4.2 Provide the analysis and improvement plan of the product through the double 85 test.
Reliability Test
AEC-Q102 Test Certification Fixed Damp Heat with Humidity Cycling (FMG), LED lamp reliability test method (GB/T 33721-2017), Component screening Ammonia test CAF test, Flame retardant grade Cyclic corrosion test (CCT), Mechanical shock test, High pressure cooker test (PCT), Highly Accelerated Stress Testing (HAST), High and low temperature and humidity test (THB), Hydrogen sulfide test (H2S), Liquid tank thermal shock test (TMSK), Component humidity sensitive grade test (MSL), Screening for high reliability use Hot flash test + acoustic sweep screening for high reliability use (MSL+SAT), LED luminaires reliability test scheme, Vibration test (VVF), Temperature cycle/thermal shock test (TC/TS), LED red Ink test UV aging test, LED light source anti-vulcanization test, Double 85 constant temperature and humidity reliability environmental test (THB), Salt spray test check.
Burn-in Oven
Burn-in is an electrical stress test that employs voltage and temperature to accelerate the electrical failure of a device. Burn-in essentially simulates the operating life of the device, since the electrical excitation applied during burn-in may mirror the worst-case bias that the device will be subjected to in the course of its useable life. Depending on the burn-in duration used, the reliability information obtained may pertain to the device's early life or its wear-out. Burn-in may be used as a reliability monitor or as a production screen to weed out potential infant mortalities from the lot.
Burn-in is usually done at 125 deg C, with electrical excitation applied to the samples. The burn-in process is facilitated by using burn-in boards (see Fig. 1) where the samples are loaded. These burn-in boards are then inserted into the burn-in oven (see Fig. 2), which supplies the necessary voltages to the samples while maintaining the oven temperature at 125 deg C. The electrical bias applied may either be static or dynamic, depending on the failure mechanism being accelerated.
Figure 1. Photo of Bare and Socket-populated Burn-in Boards
The operating life cycle distribution of a population of devices may be modeled as a bath tub curve, if the failures are plotted on the y-axis against the operating life in the x-axis. The bath tub curve shows that the highest failure rates experienced by a population of devices occur during the early stage of the life cycle, or early life, and during the wear-out period of the life cycle. Between the early life and wear-out stages is a long period wherein the devices fail very sparingly.
Figure 2. Burn-in ovens
Early life failure (ELF) monitor burn-in, as the name implies, is performed to screen out potential early life failures. It is conducted for a duration of 168 hours or less, and normally for only 48 hours. Electrical failures after ELF monitor burn-in are known as early life failures or infant mortality, which means that these units will fail prematurely if they were used in their normal operation.
High Temperature Operating Life (HTOL) Test is the opposite of ELF monitor burn-in, testing the reliability of the samples in their wear-out phase. HTOL is conducted for a duration of 1000 hours, with intermediate read points at 168 H and 500 H.
Although the electrical excitation applied to the samples are often defined in terms of voltages, failure mechanisms accelerated by current (such as electromigration) and electric fields (such as dielectric rupture) are understandably accelerated by burn-in as well.
High Temperature Furnace Inspection Index
What is the high temperature furnace test standard? What metrics are tested? How long is the detection cycle? Which items are tested?
Test items (reference) :
Temperature uniformity test, system accuracy test, temperature, system accuracy, temperature uniformity, high temperature furnace verification and calibration, high temperature furnace (tube furnace) verification and calibration, box resistance furnace (high temperature furnace, heat treatment furnace) verification and calibration, high temperature furnace (box resistance furnace, dry furnace, heat treatment furnace) verification and calibration, silica
List of testing standards:
1, NCS/ CJ M61; SAE AMS 2750; JJF1376 High temperature furnace calibration specification NCS/ CJ M61, high temperature furnace calibration method SAE AMS 2750E, box type resistance furnace calibration specification JJF1376
2, AMS 2750F High temperature measurement AMS 2750F
3, GB 25576-2010 Food safety national standard Food additive silica (high temperature furnace method)
4, JJF 1184 thermocouple verification furnace temperature field test technical specification
5, AMS 2750E high temperature measurement AMS 2750E
6, AMS 2750F high temperature determination method 3.5
7, AMS 2750G high temperature measurement AMS 2750G
8, AMS 2750E high temperature determination method 1
9. JJF 1376; AMS 2750; JJG 276 Calibration specification for box type resistance furnace JJF 1376, high temperature measurement method AMS 2750E, high temperature creep, durable strength testing machine verification regulation JJG 276
10, JJF 1376 box type resistance furnace calibration specification
11, GB/T 9452-2012 heat treatment furnace effective heating zone determination method 1
12. SAE AMS 2750 high-temperature calibration method F
Cámara de prueba de ciclos de temperatura rápida Lab CompanionIntroducción de Lab CompanionCon más de 20 años de experiencia, Compañero de laboratorio es un fabricante de cámaras ambientales de clase mundial y un destacado proveedor de sistemas y equipos de prueba llave en mano. Todas nuestras cámaras se basan en la reputación de Lab Companion de larga vida útil y confiabilidad excepcional. Con un alcance de diseño, fabricación y servicio, Lab Companion ha establecido un sistema de gestión de calidad que cumple con la Norma Internacional del Sistema de Calidad ISO 9001:2008. El programa de calibración de equipos de Lab Companion está acreditado según la norma internacional ISO 17025 y la norma nacional estadounidense ANSI/NCSL-Z-540-1 por A2LA. A2LA es miembro de pleno derecho y signatario de la Cooperación Internacional de Acreditación de Laboratorios (ILAC), la Acreditación de Laboratorios de Asia Pacífico (APLAC) y la Cooperación Europea para la Acreditación (EA). Las cámaras de pruebas ambientales de la serie SE de Lab Companion ofrecen un sistema de flujo de aire significativamente mejorado, que proporciona mejores gradientes y mejores tasas de cambio de temperatura del producto. Estas cámaras utilizan el programador/controlador 8800 insignia de Thermotron, que cuenta con una pantalla plana de 12,1” de alta resolución con interfaz de usuario táctil, capacidades ampliadas para realizar gráficos, registrar datos, editar, acceder a ayuda en pantalla y almacenamiento de datos en el disco duro a largo plazo.No solo ofrecemos productos de la más alta calidad, sino que también brindamos soporte continuo diseñado para mantenerlo en funcionamiento mucho después de la venta inicial. Brindamos servicio local directo de fábrica con un extenso inventario de las piezas que pueda necesitar. ActuaciónRango de temperatura: -70°C a +180°CRendimiento: Con una carga de aluminio de 23 kg (IEC60068-3-5), la velocidad de aumento de +85 °C a -40 °C es de 15 ℃/min; la velocidad de enfriamiento de -40 °C a +85 °C también es de 15 ℃/min.Control de temperatura: ± 1°C Temperaturas de bulbo seco desde el punto de control después de la estabilización en el sensor de controlEl rendimiento se basa en una condición ambiental de 75 °F (23,9 °C) y 50 % de humedad relativa.Rendimiento de refrigeración/calefacción basado en la medición en el sensor de control en la corriente de aire de suministroestructuraInteriorAcero inoxidable no magnético Serie 300 con alto contenido de níquelCosturas internas soldadas con heliarco para sellado hermético del liner.Esquinas y uniones diseñadas para permitir la expansión y contracción bajo las temperaturas extremas encontradas.Drenaje de condensado ubicado en el piso del liner y debajo del pleno de acondicionamientoLa base de la cámara está completamente soldada.Aislamiento de fibra de vidrio que no se asienta “Ultra-Lite”Un estante interior ajustable de acero inoxidable es estándarExteriorChapa de acero tratada moldeadaSe proporcionan cubiertas de acceso metálicas para facilitar la apertura de las puertas a los componentes eléctricos.Acabado de laca a base de agua, seca al aire, rociada sobre una superficie limpia e imprimada.Puertas de acceso con bisagras fáciles de levantar para dar servicio al sistema de refrigeraciónUn puerto de acceso de 12,5 cm de diámetro con soldadura interior y tapón aislante extraíble montado en accesorios de pared del lado derecho en puerta con bisagras para fácil acceso.CaracterísticasLa operación de la cámara muestra claramente información útil sobre el tiempo de ejecuciónGraphing Screen ofrece capacidades ampliadas, programación e informes mejoradosEl estado del sistema muestra parámetros cruciales del sistema de refrigeraciónLa entrada de programa facilita la carga, visualización y edición de perfiles.Los asistentes de configuración de pasos rápidos facilitan la entrada al perfilTablas de refrigeración emergentes para una referencia prácticaTherm-Alarm® proporciona protección de alarma de temperatura excesiva o insuficienteLa pantalla de registro de actividad proporciona un historial completo del equipoEl servidor web permite el acceso a Internet al equipo a través de EthernetEl teclado emergente fácil de usar hace que la entrada de datos sea rápida y sencillaIncluye:- Cuatro puertos USB: dos externos y dos internos- Ethernet-RS-232Especificaciones técnicas1-4 canales programables independientementePrecisión de medición: 0,25 % del intervalo típicoEscala de temperatura seleccionable °C o °FPantalla táctil de panel plano en color de 12,1” (30 cm)Resolución: 0,1°C, 0,1%RH, 0,01 para otras aplicaciones linealesReloj en tiempo real incluidoFrecuencia de muestreo: variable de proceso muestreada cada 0,1 segundosBanda Proporcional: Programable 1.0° a 300°Método de control: DigitalIntervalos: IlimitadoResolución de intervalo: 1 segundo a 99 horas, 59 minutos con resolución de 1 segundo-RS-232- Más de 10 años de almacenamiento de datos- Control de temperatura del producto- Tablero de retransmisión de eventosModos de funcionamiento: Automático o ManualAlmacenamiento del programa: ilimitadoBucles de programa:- Hasta 64 bucles por programaLos bucles se pueden repetir hasta 9999 veces.- Se permiten hasta 64 bucles anidados por
La relación entre la altitud de la atmósfera estándar y la temperatura y presión del aireLa atmósfera estándar a la que se hace referencia aquí se refiere a la "atmósfera estándar de la OACI de 1964" adoptada por la Organización de Aviación Civil Internacional. Por debajo de una altitud de 32 km, es lo mismo que la "atmósfera estándar estadounidense de 1976". Los cambios en la temperatura del aire cerca de la superficie (por debajo de 32 km) son:Tierra: La temperatura del aire es 15,0 ℃, la presión del aire P = 1013,25 mb = 0,101325 MPaTasa de cambio de temperatura desde el suelo hasta la elevación 11 km: -6,5 ℃/ kmEn la interfaz de 11km:La temperatura del aire es -56,5 ℃ y la presión del aire P = 226,32 mbTasa de cambio de temperatura en elevaciones de 11 a 20 km: 0,0 ℃/kmTasa de cambio de temperatura en altitud 20-32 km: +1,0/kmLa siguiente tabla enumera los valores de temperatura y presión de la atmósfera estándar a diferentes altitudes. En la tabla, "gpm" es el medidor de altitud y su signo negativo representa la altitud.gpmTemperatura℃Presión atmosférica (mb)gpmTemperatura℃Presión atmosférica (mb)gpmTemperatura℃Presión atmosférica (mb)-40017.61062.24800-16.2554,810000-50.0264,4-20016.31037.55000-17,5540.210200-51,3256,4015.01013.35200-18,8525,910400-52,6248,620013.7989,55400-20.1511.910600-53,9241.040012.4966.15600-21,4498,310800-55,2233,660011.1943.25800-22,7484,911000-56,5226,38009.8920,86000-24.0471,811500-56,5209.210008.5898,76200-25,3459.012000-56,5193.312007.2877.26400-26,6446,512500-56,5178,714005.9856.06600-27,9434.313000-56,5165.116004.6835.26800-29,2422.313500-56,5152,618003.3814,97000-30,5410.614000-56,5141.020002.0795.07200-31,8399,214500-56,5130.322000,7775,47400-33.1388.015000-56,5120,52400-0,6756,37600-34,4377.115500-56,5111.32600-1.9737,57800-35,7366,416000-56,5102,92800-3.2719.18000-37.0356.017000-56,587,93000-4,5701.18200-38,3345,818000-56,575.03200-5,8683,48400-39,6335,919000-56,564.13400-7.1666,28600-40,9326.220000-56,554,73600-8.4649,28800-42,2316,722000-54,540.03800-9,7632,69000-43,5307.424000-52,529.34000-11.0616,49200-44,8298,426000-50,521,54200-12.3600.59400-46,1289,628000-48,515.94400-13,6584,99600-47,4281.030000-46,511.74600-14,9569,79800-48,7272,632000-44,58.7Relación de conversión de unidades1 mbar = 100 Pa = 0,1 KPa = 0,0001 Mpa1 pie = 0,3048 m = 304,8 mm55000 pies*0,3048=16764 mLab Companion se centró en la producción de equipos de prueba ambiental de confiabilidad durante 19 años y ayudó con éxito a 18 000 empresas a probar la confiabilidad y el desempeño ambiental de productos y materiales.Los principales productos son: cámara de prueba de alta temperatura, cámara de prueba de alta y baja temperatura y humedad, cámara de prueba ambiental sin cita previa, cámara de prueba de ciclos rápidos de temperatura, cámara de prueba de choque térmico, cámara de prueba de baja presión y alta temperatura, vibración de la cámara integral y otras soluciones de fabricación de equipos de prueba para ayudar a las empresas de I + D a ser más grandes y más fuertes.Si necesita saber más sobre los productos de la cámara de pruebas ambientales, puede buscar en el sitio web oficial de "Lab Companion", no dude en contactarnos para realizar consultas, podemos brindarle orientación y asesoramiento técnico profesional personalizado. .
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